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58th DAC Keynote Speakers
The Potential of Machine Learning for Hardware Design
In this talk Ill describe the tremendous progress in machine learning over the last decade, how this has changed the hardware we want to build for performing such computations, and describe some of the areas of potential for using machine learning to help with some difficult problems in computer hardware design. Ill also briefly touch on some future directions for machine learning and how this might affect things in the future.
GPUs, Machine Learning, and EDA
GPU-accelerated computing and machine learning (ML) have revolutionized computer graphics, computer vision, speech recognition, and natural language processing. We expect ML and GPU-accelerated computing will also transform EDA software and as a result, chip design workflows. Recent research shows that orders of magnitudes of speedups are possible with accelerated computing platforms and that the combination of GPUs and ML can enable automation on tasks previously seen as intractable or too difficult to automate. This talk will cover near-term applications of GPUs and ML to EDA tools and chip design as well as a long term vision of what is possible. The talk will also cover advances in GPUs and ML-hardware that are enabling this revolution.
When the Winds of Change Blow, Some People Build Walls and Others Build Windmills
Mr. Costello is considered to have founded the EDA industry when in the late 1980s he became President of Cadence Design Systems and drove annual revenues to over $1B—the first EDA company to achieve that milestone. In 2004, he was awarded the Phil Kaufman Award by the Electronic System Design Alliance in recognition of his business contributions that helped grow the EDA industry. After leaving Cadence, Joe has led numerous startups to successful exits such as Enlighted, Orb Networks, think3, and Altius. He received his BS in Physics from the Harvey Mudd College and also has a masters degree in Physics from both Yale University and UC Berkeley.
AI, Machine Learning, Deep Learning: Where are the Real Opportunities for the EDA Industry?
58th DAC SkyTalk Speakers
Cloud & AI Technologies for Faster, Secure Semiconductor Supply Chains
Semiconductors are deeply embedded in every aspect of our lives, and recent security threats and global supply chain challenges have put a spotlight on the industry. Significant investments are being made both by nation states and commercial industry, to manage supply chain dependencies, ensure integrity and build secure, collaborative environments to foster growth. These shifts provide unique opportunities for our industry. This talk blends insights and experiences from government initiatives and Azures Special Capabilities & Infrastructure programs, to outline how Cloud + AI technologies, along with tool vendors, fabless semiconductor companies, IP providers, foundries, equipment manufacturers and other ecosystem stakeholders can contribute to building a robust, end-to-end, secure silicon supply chain for both commercial and government applications, while generating value for their businesses.
The precision scaling powered performance roadmap for AI Inference and Training systems
Over the past decade, Deep Neural Network (DNN) workloads have dramatically increased the computational requirements of AI Training and Inference systems – significantly outpacing the performance gains obtained traditionally using Moores law of silicon scaling. New computer architectures, powered by low precision arithmetic engines (FP16 for training and INT8 for Inference), have laid the foundation for high performance AI systems – however, there remains an insatiable desire for AI compute with much higher power-efficiency and performance. In this talk, Ill outline some of the exciting innovations as well as key technical challenges – that can enable systems with aggressively scaled precision for inference and training, while fully preserving model fidelity. Ill also highlight some key complementary trends, including 3D stacking, sparsity and analog computing, that can enable dramatic growth in the AI system capabilities over the next decade.
Cross-Disciplinary Innovations Required for the Future of Computing
With traditional drivers of compute performance a thing of the past, innovative engineers are tapping into new vectors of improvement to meet the worlds demand for computation. Like never before, the future of computing will be owned by those who can optimize across the previously siloed domains of silicon design, processor architecture, package technology and software algorithms to deliver performance gains with new capabilities. These approaches will derive performance and power efficiency through tailoring of the architecture to particular workloads and market segments, leveraging the much greater performance/Watt and performance/area of accelerated solutions. Designing and verifying multiple tailored solutions for markets where a less efficient general purpose design formerly sufficed can be accomplished through modular architectures using 2.5D and 3D packaging approaches. Delivering on modular solutions for high volume markets requires simultaneously optimizing across packaging, silicon, interconnect technologies where in the past, silicon design was sufficient. This talk will cover these trends with the vectors of innovation required to deliver these next generation compute platforms.